PESM 2024 is the 14th event in a series devoted to plasma etch and strip processes for micro-, nano- and bio-technologies. PlaCEP is the 2nd workshop on plasma cryogenic etch processes. Both workshops will be held in June 2024 in imec, Leuven (Belgium).

The objective of the PESM/PlaCEP workshops is to provide a forum for open discussions between science and technology. It is not only dedicated to scientists, process engineers and Ph-D students, but also to industrial partners in the field of dry etching, including plasma processing but also other vacuum-based removal techniques (ion beam, neutral beam, gaseous thermal etching, etc...). Topics may include both fundamental and applied research highlights, as well as issues related to the introduction of new technologies into manufacturing.

PESM 2024 will focus on plasma etching and cleaning challenges: in III-V and III-N semi-conductor processing for power or photovoltaics applications, in dielectrics/metals processing for advanced memory technologies (OXRAM, PCRAM, MRAM, FeRAM ...), in More than More applications (MEMS, photonics, Imagers) and advanced logic applications (Si-based CMOS, spin logic, 2D materials, quantum computing). It will be also dedicated to emerging plasma etching concepts and technology (ALE) and the fundamental aspects of plasmas (new plasma sources, Diagnostics, Modelling ...). Ion beam processes, used for the etch of non-volatile materials, will also be covered. A special attention will be paid to recent technology combining plasma surface preparation and vapor etch. PlaCEP 2024 will bring a special attention to plasma chemistries at temperatures well below 0°C, with a focus on Si and III-V compounds, their oxide compounds, ALE, and high aspect ratio nanoholes for 3D NAND fabrication.

To stimulate technical discussions, invited talks will be given by scientific and technical leaders of the etch community, in each of the key areas defined above.