Topic 1: etching processes for semiconductors (Si, III-V, nitrides, ….)

• CMOS
• 2D materials (MX2, Graphene, CNTs) • Power electronics (SiC, GaN…)
• LEDs
• Solar cells

Topic 2: etching processes for advanced memory applications

• DRAM
• FeRAM
• MRAM
• OTS (SCM)
• 3D-NAND

Topic 3: etching processes for more than Moore applications

• MEMS
• NEMS
• Imagers
• Photonics
• Life science

Topic 4: emerging etching concepts and technology fundamentals

• Plasma etching fundamentals (new chemistries)
• Alternative lithography
• ALE – Atomic Layer Etching
• ACL – Atomic Layer Cleaning
• ASD – Area Selective Deposition
• Heteregeneous/combined etch processes (plasma/wet, plasma/vapor, IBE/vapor,…)

Topic 5: plasma, vapor cleaning and isotropic etch concepts

• FIN recess, stacked nanosheet fabrication 
• Cavity etch, MEMS/NEMS release
• Surface cleaning and decontamination (including reactor cleaning)

Topic 6: plasma diagnostics and simulation

• New plasma sources
• Plasma / reactor diagnostics
• Plasma, process and surface chemistry modelling

Topic 7: Cryo-etching (conventional and emerging materials, dielectrics, mechanisms at low temperature and modeling)

• cryoetching of conventional materials : semiconductor (silicon, germanium, gallium arsenide, indium phosphide...) and dielectrics (SiO2, Si3N4 for 3D NAND)
• Cryo-etching of emerging materials (2D-materials, porous material...)
• Modeling of cryo-etching mechanisms