Invited speakers
Dr. Zhiying Chen, Tokyo Electron America, Inc. (USA)
New directions for plasma diagnostics in the era of atomic precision semiconductor device manufacturing
Prof. Christophe Vallée, CNSE, university at Albany (USA)
ASD on EUV Metal-oxide resists
Prof. Emilie Despiau-Pujo, université Grenoble-Alpes, Grenoble (France
Multiscale hybrid modelling of resist microlenses etching in DF-CCP CF4 plasmas
Prof. Makoto Sekine, university of Nagoya (Japan)
Cryogenic plasma etching in semiconductor processes with reduced environmental impact
Dr. Thorsten Lill, Lam Research (USA)
Elementary processes in cryo etching of dielectric high aspect ratio structures
Dr. Mituhiro Omura, Kioxia Corp. (Japan)
Expectation for cryo etching technology for 3D flash memory
Prof. Adrie Mackus, Eindhoven university of Technology (The Netherlands)
Plasma-assisted isotropic atomic layer etching for fabrication of nanoelectronics
Dr. Yann Canvel, imec v.z.w. (Belgium)
Understanding complex and scalable patterning of (novel) materials for memory and logic applications
Dr. Aurélien Tavernier, université Grenoble-Alpes, CEA, Leti, Grenoble (France)
Photoresist on polymer etch challenges for imager filters patterning