Invited speakers

Dr. Zhiying Chen, Tokyo Electron America, Inc. (USA)


New directions for plasma diagnostics in the era of atomic precision semiconductor device manufacturing

Prof. Christophe Vallée, CNSE, university at Albany (USA)


ASD on EUV Metal-oxide resists

Prof. Emilie Despiau-Pujo, université Grenoble-Alpes, Grenoble (France


Multiscale hybrid modelling of resist microlenses etching in DF-CCP CF4 plasmas

Prof. Makoto Sekine, university of Nagoya (Japan)


Cryogenic plasma etching in semiconductor processes with reduced environmental impact

Dr. Thorsten Lill, Lam Research (USA)


Elementary processes in cryo etching of dielectric high aspect ratio structures

Dr. Mituhiro Omura, Kioxia Corp. (Japan)


Expectation for cryo etching technology for 3D flash memory

Prof. Adrie Mackus, Eindhoven university of Technology (The Netherlands)


Plasma-assisted isotropic atomic layer etching for fabrication of nanoelectronics

Dr. Yann Canvel, imec v.z.w. (Belgium)


Understanding complex and scalable patterning of (novel) materials for memory and logic applications

Dr. Aurélien Tavernier, université Grenoble-Alpes, CEA, Leti, Grenoble (France)


Photoresist on polymer etch challenges for imager filters patterning